Diamond wire drawing die device through four generation of change

Diamond wire drawing die and equipment has experienced four generations change, by mechanical grinding type first, showed extremely low efficiency, poor die hole grinding, precision integrated now into the piezoelectric ultrasonic EDM compound processing technology and equipment, performance characteristics of diamond wire drawing die pass by it with good, high surface smoothness. Processing of large aperture of polycrystalline diamond die, if coupled with the electric spark, the processing efficiency doubled.
So far, for diamond wire drawing die wire and cable manufacturing and equipment, has experienced four generations of change.
The first generation of mechanical grinding, the grinding of diamond wire drawing mould manufacturing and repair, the efficiency is very low, die hole grind the poor, has been rarely used.
The second generation of electronic tube telescopic tube, the signal amplifier, converted into mechanical energy through the magnetostrictive transducer, used for grinding of diamond die. This type of defect is converting magnetostrictive transducer efficiency is too low, and the need for external circulation cooling water on the cooling. The equipment failure rate is high, the manufacturers are not many.
The third generation of transistor piezoelectric type, the electrical signal transistor power provided by piezoelectric ceramic transducers that convert mechanical vibrations, it has the advantages of high conversion efficiency of piezoelectric ceramics, and need not additional cooling system. The volume of the equipment is reduced, so far the application up, gradually replaced the old mechanical grinding machine and electron tube magnetostrictive type grinding machine, become the mainstream of mold manufacturing equipment. The disadvantages include: transistor circuit harmonic distortion, transverse vibration transducer is easy to produce, manufacture of natural diamond micro aperture die for such models, diamond is easy to be broken and broken, the low rate of finished products. High power transistor, easily damaged, can not be used to manufacture large diameter polycrystalline diamond drawing die.
The fourth generation of sophisticated integrated piezoelectric ultrasonic EDM compound processing technology and equipment, by the Beijing Municipal Institute of electro machining research and development. This machine adopts high-power top audio integrated circuits, with micro precision spark power by converting the piezoelectric ceramic type titanium alloy transducer, ultrasonic, EDM Compound Machining of diamond wire drawing die. It is characterized as a high fidelity audio amplifier chip provides the ultrasonic signal, the internal circuit functions, including automatic gain control circuit (AGC), over temperature protection circuit, a load short circuit protection circuit, has the advantages of small total harmonic distortion, low noise. Titanium alloy with low impedance, high Q value, the internal loss of small, high mechanical strength, long service life, stable performance, higher conversion efficiency. Combining the need audio circuit and a piezoelectric ceramic transducer generates ultrasonic titanium alloy, very pure, no clutter and transverse vibration. Using diamond wire drawing die pass it processed, high surface smoothness. Processing of large aperture of polycrystalline diamond die, if coupled with the electric spark, the processing efficiency doubled.
The fourth generation of precision integrated piezoelectric ultrasonic processing machine. Beijing Inst of electric processing at the end of 1991 the first successfully developed, and quickly applied in manufacturing diamond wire drawing die field. The first batch of the model of the machine is bdc-50a, the purpose is to improve the manufacturing of natural diamond micro aperture mould precision, make the roundness and pass accuracy sub micron, surface roughness to a mirror level.